Underfill Flow Numerical Simulation for Achieving Board Level Low Cost and High Reliability of Mobile Devices-Reference-Cited by-同舟云学术

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Underfill Flow Numerical Simulation for Achieving Board Level Low Cost and High Reliability of Mobile Devices

Published:2023-08-08 Issue: Volume: Page:1-7
ISSN:
Container-title:2023 24th International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Jiang Yiming¹,Shi Hongbin¹,Lv Xiang¹

Affiliation:

1. Huawei Technologies Co., Ltd.,Xi’an,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492193.pdf?arnumber=10492193

Reference9 articles.

1. Underfill and edgebond for enhancing of board level reliability (IMPACT 2014)

2. Capillary-driven micro flows for the underfill process in microelectronics packaging

3. Underfill Flow in Flip-Chip Encapsulation Process: A Review

4. Analysis of the flow of encapsulant during underfill encapsulation of flip-chips

5. Capillary impregnation into cylinder banks

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