Capillary-driven micro flows for the underfill process in microelectronics packaging
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials
Link
http://link.springer.com/content/pdf/10.1007/s12206-012-1001-7.pdf
Reference30 articles.
1. E. W. Washburn, The dynamics of capillary flow, Phys. Rev., 17 (1921) 273–283.
2. N. Ichikawa, K. Hosokawa and R. Maeda, Interface motion of capillary-driven flow in rectangular microchannel, J. Colloid and Interface Sci., 280 (2004) 155–164.
3. W. R. Jong, T. H. Kuo, S. W. Ho, H. H. Chiu and S. H. Peng, Flows in rectangular microchannels driven by capillary forces and gravity, Int. Comm. Heat and Mass Transfer, 34 (2007) 186–196.
4. R. R. Tummala, Fundamentals of Microsystems Packaging, McGraw-Hill, Singapore, Singapore (2001).
5. D. Suryanarayana, R. Hsiao, T. P. Gall and J. M. McCreary, Enhancement of flip-chip fatigue life by encapsulation, IEEE Comp., Hybrids, and Manufacturing Technology, 14(1) (1991) 218–223.
Cited by 21 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Dynamics of Passive Filling of Fluids in Cylindrical Capillaries;Industrial & Engineering Chemistry Research;2024-04-08
2. The Phenomenon of Tunnel Structure Mold Flowability Experiment Result and Simulation Study;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05
3. Capillary Underfill Flow Simulation and Experimental Study for Solder Mask Opening and Trace Distribution in Bump Layout Design;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05
4. Deep learning and analytical study of void regional formation in flip-chip underfilling process;Soldering & Surface Mount Technology;2023-10-24
5. Underfill Flow Numerical Simulation for Achieving Board Level Low Cost and High Reliability of Mobile Devices;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3