Optimization of Process Parameters for Molding Simulation of Open Cavity QFN
Author:
Affiliation:
1. Chung-Li Central Development Engineering,ASE Group
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10012686/10013085/10013148.pdf?arnumber=10013148
Reference14 articles.
1. Underfill process for two parallel plates and flip chip packaging
2. Particle-Fluid Simulation of Flip Chip Capillary Underfill Process Using Discrete Phase Model;fei;International Journal of Mechanical and Production Engineering,2017
3. Numerical simulation of conventional capillary flow and no-flow underfill in flip-chip packaging
4. Simulation and experiment study of dispensing patterns influence on underfill filling process
5. Capillary-driven micro flows for the underfill process in microelectronics packaging
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