Numerical simulation of conventional capillary flow and no-flow underfill in flip-chip packaging-Reference-Cited by-同舟云学术

Numerical simulation of conventional capillary flow and no-flow underfill in flip-chip packaging

Published:2008-06 Issue:5 Volume:37 Page:520-523
ISSN:0045-7930
Container-title:Computers & Fluids
language:en
Short-container-title:Computers & Fluids

Author:

Hashimoto Tomohisa,Shin-ichiro Tanifuji,Morinishi Koji,Satofuka Nobuyuki

Publisher

Elsevier BV

Subject

General Engineering,General Computer Science

Reference11 articles.

1. Wan J. Analysis and modeling of underfill flow driven capillary action in flip-chip packaging. Doctor thesis. University of Saskatchewan; 2005.

2. Kolbeck A, Hauck T, Jendrny J, Hahn O, Lang S. No-flow underfill process for flip-chip assembly. In: 14th European microelectronics and packaging conference and exhibition; 2003. p. 1–5.

3. Analysis of the mold filling process on flip chip package;Shen;J Reinf Plast Compos,2004

4. Upwind differencing scheme for the time-accurate incompressible Navier–Stokes equations;Rogers;AIAA J,1990

5. Jameson A, Baker TJ. Solution of the Euler equations for complex configurations. AIAA Paper 83-1929; 1983.

Cited by 24 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The Phenomenon of Tunnel Structure Mold Flowability Experiment Result and Simulation Study;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

2. Optimization of Process Parameters for Molding Simulation of Open Cavity QFN;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07

3. Investigation of The Flow Behaviors for Capillary Underfill Process in Flip-Chip Packaging;2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC);2021-12-07

4. Underfill Flow in Flip-Chip Encapsulation Process: A Review;Journal of Electronic Packaging;2021-08-06

5. No-flow underfill: Effect of chip placement speed on the void formation using numerical method;Microelectronics Journal;2021-08