The Phenomenon of Tunnel Structure Mold Flowability Experiment Result and Simulation Study
Author:
Affiliation:
1. ASE Group Chung-Li Central Development Engineering
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10457288/10457581/10457588.pdf?arnumber=10457588
Reference16 articles.
1. Mold Flow Analysis and Optimization in Injection Molding Process for Semiconductor Packages
2. Mold Flow Simulation Analysis of Molded Underfill in an Ultra-thin High-Density Package
3. Comparative Analysis of Flow Capability of Epoxy Molding Compound between Spiral Structure and Actual Mold by Mold Flow Simulation
4. Simulation of the Filler Stuck Mechanism in Molding Process and Verification
5. A Study of Underfill Dispensing Process;Chia
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