Author:
Loh Wei Keat,Kulterman Ron W.,Hsu Chih Chung,Fu Haley
Cited by
5 articles.
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1. Analysis of Thin Flip Chip Chip-Scale Package Warpage Causes and Variations;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. Deformation analysis of QFN packages for validation of thermo-mechanical finite element simulations;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
3. Impact of Viscoelastic Properties on Package Warpage Prediction;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
4. Comparative Analysis of Flow Capability of Epoxy Molding Compound between Spiral Structure and Actual Mold by Mold Flow Simulation;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10
5. Mold Flow Simulation Analysis of Molded Underfill in an Ultra-thin High-Density Package;2022 IEEE 5th International Conference on Electronics Technology (ICET);2022-05-13