Mold Flow Simulation Analysis of Molded Underfill in an Ultra-thin High-Density Package-Reference-Cited by-同舟云学术

Mold Flow Simulation Analysis of Molded Underfill in an Ultra-thin High-Density Package

Published:2022-05-13 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 5th International Conference on Electronics Technology (ICET)
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Author:

Li Yulong¹,Zhong Cheng¹,Li Chenglong²,Jiang Ruoyu³,Lu Jibao¹,Sun Rong¹

Affiliation:

1. Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Science,Shenzhen,China,518055

2. Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Science School of Mechanical Science and Engineering, Huazhong University of Science and Technology,Shenzhen,China,518055

3. Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Science University of Science and Technology of China,Shenzhen,China

Funder

National Natural Science Foundation of China

Youth Innovation Promotion Association

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9823394/9823964/09824202.pdf?arnumber=9824202

Reference8 articles.

1. Warpage of Compression Molded SiP Strips

2. Modeling of Molded Electronic Package Warpage Characteristic with Cure Induced Shrinkage and Viscoelasticity Properties

3. Mold Flow Analysis of a SiP Package for Power Management

4. Package with simulation method to predict underfill flow pattern with different dispensed condition

5. A novel model for simulating the racing effect in capillary-driven underfill process in flip chip

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