Characterizing junction-to-case thermal resistance and its impact on end-use applications-Reference-Cited by-同舟云学术

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Characterizing junction-to-case thermal resistance and its impact on end-use applications

Published:2012-05 Issue: Volume: Page:
ISSN:
Container-title:13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
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Author:

Galloway Jesse E.,Bhopte Siddharth,Nelson Cameron

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/6222648/6231398/06231576.pdf?arnumber=6231576

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