Quick Assessment Methodology for Thermal Impedance Prediction Apply to IC Package-Reference-Cited by-同舟云学术

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Quick Assessment Methodology for Thermal Impedance Prediction Apply to IC Package

Published:2023-10-25 Issue: Volume: Page:
ISSN:
Container-title:2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
language:
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Author:

Lai Jin Yuan¹,Yang Shin Yueh¹,Ong Yeow Chon²,Che Fa Xing²,Ng Hong Wan²

Affiliation:

1. Micron Memory Taiwan Co., Ltd,Taichung City 421,Taiwan,R.O.C.,42152

2. Micron Semiconductor Asia Operations Pte. Ltd,Singapore,Singapore,339942

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10348606/10348630/10348833.pdf?arnumber=10348833

Reference6 articles.

1. The junction-to-case thermal resistance: A boundary condition dependent thermal metric

2. Characterizing junction-to-case thermal resistance and its impact on end-use applications

3. Measurement and Simulation of Stacked Die Thermal Resistances

4. theta /sub jc/ characterization of chip packages-justification, limitations, and future

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