1. Numerical Evaluation of P-Channel MOSFETs Depending on the TID Effect Using Electric-Thermal Analysis;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
2. Quick Assessment Methodology for Thermal Impedance Prediction Apply to IC Package;2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2023-10-25
3. Applicability of JESD51-14 to clip-bonded, discrete power devices;2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2023-09-27
4. Thermal Circuit Models of Microstrip Lines Based on Precise Heat Spreading Angles and Convection Boundary Conditions;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-03
5. Thermal Resistance Measurements Method for Press-pack Power Devices;2022 IEEE 5th International Conference on Automation, Electronics and Electrical Engineering (AUTEEE);2022-11-18