Author:
Bar-Cohen A.,Elperin T.,Eliasi R.
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,General Engineering,Electronic, Optical and Magnetic Materials
Cited by
59 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Quick Assessment Methodology for Thermal Impedance Prediction Apply to IC Package;2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2023-10-25
2. Boundary Condition Independent Compact Thermal Models Enhanced by Contour Elements;2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2023-09-27
3. A Guide for Accurate and Repeatable Measurement of the RTH, JC of SiC Packages;2022 IEEE Energy Conversion Congress and Exposition (ECCE);2022-10-09
4. Galerkin’s Projection Framework for BCI CTMs—Part I: Extended FANTASTIC Approach;IEEE Transactions on Components, Packaging and Manufacturing Technology;2021-11
5. TONIC: TOol for Nonlinear BCI CTMs of Integrated Circuits;2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2021-09-23