A Guide for Accurate and Repeatable Measurement of the R<sub>TH, JC</sub> of SiC Packages-Reference-Cited by-同舟云学术

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A Guide for Accurate and Repeatable Measurement of the R_{TH, JC} of SiC Packages

Published:2022-10-09 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE Energy Conversion Congress and Exposition (ECCE)
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Author:

Knoll Jack¹,DiMarino Christina¹,Buttay Cyril²

Affiliation:

1. Center for Power Electronics Systems (CPES),Virginia Tech,Blacksburg,VA,USA

2. Univ Lyon, CNRS, INSA Lyon, Ecole Centrale de Lyon, Université Claude Bernard Lyon1, Ampère, UMR 5005,Villeurbanne,France,69621

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9947299/9947300/09947814.pdf?arnumber=9947814

Reference21 articles.

1. Effect of case temperature measurement errors on the junction-to-case thermal resistance of a ceramic PGA

2. Transient Dual Interface Test Method for the Measurement of the Thermal Resistance Junction-to-Case of Semiconductor Devices with Heat Flow Through a Single Path;jESD51-14,2010

3. Transient dual interface measurement — A new JEDEC standard for the measurement of the junction-to-case thermal resistance

4. Study on the Method to Measure the Junction-to-Case Thermal Resistance of Press-Pack IGBTs

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Graphite Heat Spreader Embedded in a PCB Package for Improved SiC Die RthJC;2023 IEEE Energy Conversion Congress and Exposition (ECCE);2023-10-29

2. A PCB-Embedded 1.2 kV SiC MOSFET Package With Reduced Manufacturing Complexity;IEEE Open Journal of Power Electronics;2023

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