A 6.4-Gb/s/pin nand Flash Memory Multichip Package Employing a Frequency Multiplying Bridge Chip for Scalable Performance and Capacity Storage Systems-Reference-Cited by-同舟云学术

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A 6.4-Gb/s/pin nand Flash Memory Multichip Package Employing a Frequency Multiplying Bridge Chip for Scalable Performance and Capacity Storage Systems

Published:2024 Issue: Volume:7 Page:115-118
ISSN:2573-9603
Container-title:IEEE Solid-State Circuits Letters
language:
Short-container-title:IEEE Solid-State Circuits Lett.

Author:

Ikeda Shinichi¹^ORCID,Iwata Akira¹^ORCID,Otomo Goichi¹^ORCID,Suzuki Tomoaki¹^ORCID,Iijima Hiroaki¹^ORCID,Shiraishi Mikio¹^ORCID,Kawakami Shinya¹^ORCID,Eimitsu Masatomo¹^ORCID,Matsuoka Yoshiki¹^ORCID,Sato Kiyohito¹^ORCID,Tsuchiya Shigehiro¹^ORCID,Shigeta Yoshinori¹^ORCID,Aoyama Takuma¹^ORCID

Affiliation:

1. Institute of Memory Technology Research and Development, Kioxia Corporation, Yokohama, Japan

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx7/8011414/10359146/10472519.pdf?arnumber=10472519

Reference9 articles.

1. A 1-Tb 4b/Cell 4-Plane 162-Layer 3D Flash Memory With a 2.4-Gb/s I/O Speed Interface

2. 13.5 A 128Gb 1b/Cell 96-Word-Line-Layer 3D Flash Memory to Improve Random Read Latency with tPROG=75µs and tR=4µs

3. 7.6 1GB/s 2Tb NAND flash multi-chip package with frequency-boosting interface chip

4. A 1.2V 1.33Gb/s/pin 8Tb NAND flash memory multi-chip package employing F-chip for low power and high performance storage applications

5. A 1.8-Gb/s/Pin 16-Tb NAND Flash Memory Multi-Chip Package With F-Chip for High-Performance and High-Capacity Storage

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