Finite Element Simulation of Solid–Liquid Interdiffusion Bonding Process: Understanding Process-Dependent Thermomechanical Stress-Reference-Cited by-同舟云学术

Finite Element Simulation of Solid–Liquid Interdiffusion Bonding Process: Understanding Process-Dependent Thermomechanical Stress

Published:2022-05 Issue:5 Volume:12 Page:847-856
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Tiwary Nikhilendu¹^ORCID,Vuorinen Vesa¹^ORCID,Ross Glenn¹^ORCID,Paulasto-Krockel Mervi¹^ORCID

Affiliation:

1. Department of Electrical Engineering and Automation, Aalto University, Otaniemi, Espoo, Finland

Funder

Electronic Components and Systems for European Leadership (ECSEL) Joint Undertaking

Advanced Packaging for Photonics, Optics and Electronics for Low Cost Manufacturing in Europe (APPLAUSE) Project

Innovative Funding Agency Business Finland

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

Reference44 articles.

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