The Role of Ultrafine Crystalline Behavior and Trace Impurities in Copper on Intermetallic Void Formation
Author:
Affiliation:
1. Department of Electrical Engineering and Automation, Aalto University, P.O. Box 13500, FIN-00076 Aalto, Finland
2. Chemistry and Chemical Engineering, Chalmers University of Technology, Kemivägen 10, SE-412 96 Gothenburg, Sweden
Publisher
American Chemical Society (ACS)
Subject
Materials Chemistry,Electrochemistry,Electronic, Optical and Magnetic Materials
Link
https://pubs.acs.org/doi/pdf/10.1021/acsaelm.8b00029
Reference29 articles.
1. Reliability challenges in 3D IC packaging technology
2. Impact of Thermal Cycling on Sn-Ag-Cu Solder Joints and Board-Level Drop Reliability
3. Effect of contact metallization on electromigration reliability of Pb-free solder joints
4. Effects of sulfide-forming element additions on the Kirkendall void formation and drop impact reliability of Cu/Sn–3.5Ag solder joints
5. Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability
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