Abstract
AbstractSolid–liquid interdiffusion is a metallurgical bonding technique, suitable for assembly of temperature sensitive materials. We identify Ag-(In-Bi) as meeting the low-temperature bonding requirements, theoretically as low as 73°C. This work focuses on understanding the bonding process and the interactions between the metal elements. Ag-(In-Bi) was bonded using an eutectic In-Bi foil at both 150°C and 180°C. The resulting bondlines were layered as Ag/Ag9In4/AgIn2/In-Bi compounds/AgIn2/Ag9In4/Ag. At some sections the phase growth of AgIn2 or Ag9In4 bridged the bond. Because of this bridging of γ-Ag9In4, temperature stability of ~480–570°C, is readily possible. The majority of the remaining Bi was located within large pockets near the middle of the bondline, and the minority as precipitates in protruding arms. Mechanisms for these Bi precipitates and intermetallic arm growth are discussed, and the evidence indicates that dissolution and surface planarity play important roles in their formation.
Funder
Norges Forskningsråd
University Of South-Eastern Norway
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
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