Analysis of low-temperature intermetallic growth in copper-tin diffusion couples-Reference-Cited by-同舟云学术

Analysis of low-temperature intermetallic growth in copper-tin diffusion couples

Published:1992-03 Issue:3 Volume:23 Page:857-864
ISSN:0360-2133
Container-title:Metallurgical Transactions A
language:en
Short-container-title:MTA

Author:

Mei Z.,Sunwoo A. J.,Morris J. W.

Publisher

Springer Science and Business Media LLC

Subject

Metals and Alloys,Mechanics of Materials,Condensed Matter Physics,Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

http://link.springer.com/content/pdf/10.1007/BF02675563.pdf

Reference37 articles.

1. K.N. Tu:Acta Metall., 1973, vol. 21, pp. 347–54.

2. P.E. Davis, M.E. Warwick, and S.J. Muckett:Plating Surf. Finishing, 1983, vol. 70, pp. 49–53.

3. P.E. Davis, M.E. Warwick, and P.J. Kay:Plating Surf. Finishing, 1982, vol. 69, pp. 72–76.

4. A.D. Romig, Jr., Y.A. Chang, J.J. Stephens, D.R. Frear, V. Marcotte, and C. Lea: inSolder Mechanics A State of the Art Assessment, D.R. Frear, W.B. Jones, and K.R. Kinsman, eds., TMS, Warrendale, PA, 1991, pp. 29–104.

5. A. Sunwoo, J.W. Morris, Jr., and G.K. Lucey, Jr.:Metall. Trans. A, in press.

Cited by 215 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A level set approach to modelling diffusional phase transformations under finite strains with application to the formation of Cu6Sn5;Computational Materials Science;2024-09

2. Evaluation of Solidification and Interfacial Reaction of Sn-Bi and Sn-Bi-In Solder Alloys in Copper and Nickel Interfaces;Metals;2024-08-25

3. The role of Sn grain orientation in Cu depletion of Sn-based solders;Modelling and Simulation in Materials Science and Engineering;2024-07-05

4. Investigative characterization of delamination at TiW-Cu interface in low-temperature bonded interconnects;Materials Characterization;2024-03

5. Cobalt-Graphene NanoSheets enhanced Sn–0.3Ag–0.7Cu composite solder: Study on microstructure, crystal orientation relations and mechanical properties;Materials Science and Engineering: A;2024-03