Author:
Golim Obert,Vuorinen Vesa,Ross Glenn,Suihkonen Sami,Paulasto-Kröckel Mervi
Reference54 articles.
1. Challenges and recent prospectives of 3D heterogeneous integration;Zhang;e-Prime - Adv. Electric. Eng. Electron. Energy,2022
2. Recent advances and trends in advanced packaging;Lau;IEEE Trans. Compon. Packag. Manuf. Technol.,2022
3. Recent advances and trends in Chiplet design and heterogeneous integration packaging;Lau;J. Electron. Packag.,2024
4. Optimal channel design for die-to-die interface in multi-die integration applications;Park,2023
5. The era of hyper-scaling in electronics;Salahuddin;Nat. Electron.,2018