Simulation of device structure impacts on bonding wave and strain in Wafer-to-Wafer Cu-Cu Hybrid Bonding
Author:
Affiliation:
1. Sony Semiconductor Solutions Corporations,Kanagawa,Japan
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195645.pdf?arnumber=10195645
Reference8 articles.
1. Mesa-Spacers: Enabling Nondestructive Measurement of Surface Energy in Room Temperature Wafer Bonding
2. Direct silicon bonding dynamics: A coupled fluid/structure analysis
3. Multi-Physics Simulation of Wafer-to-Wafer Bonding Dynamics
4. Investigation of Post-Bond Distortion in Direct Wafer Bonding
5. Development of a classical force field for the oxidized Si surface: Application to hydrophilic wafer bonding
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