Development of a classical force field for the oxidized Si surface: Application to hydrophilic wafer bonding-Reference-Cited by-同舟云学术

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Development of a classical force field for the oxidized Si surface: Application to hydrophilic wafer bonding

Published:2007-11-28 Issue:20 Volume:127 Page:204704
ISSN:0021-9606
Container-title:The Journal of Chemical Physics
language:en
Short-container-title:The Journal of Chemical Physics

Author:

Cole Daniel J.,Payne Mike C.,Csányi Gábor,Mark Spearing S.,Colombi Ciacchi Lucio

Publisher

AIP Publishing

Subject

Physical and Theoretical Chemistry,General Physics and Astronomy

Link

http://aip.scitation.org/doi/pdf/10.1063/1.2799196

Reference39 articles.

1. Semiconductor wafer bonding

2. Wafer bonding for silicon‐on‐insulator technologies

3. Silicon‐to‐silicon direct bonding method

4. Mechanics of direct wafer bonding

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