A Novel Approach to Measure and Characterize Radiation Patterns of Antenna-in-Package-Reference-Cited by-同舟云学术

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A Novel Approach to Measure and Characterize Radiation Patterns of Antenna-in-Package

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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Author:

Jogalekar Aditya N.¹,Medina Oscar F.¹,Iyer Mahadevan K.²,Blanchard Andrew¹,Henderson Rashaunda¹,Murugan Rajen³,Bakshi Harshpreet³,Ali Hassan⁴

Affiliation:

1. The Univeristy of Texas at Dallas,Dept. of ECE,Richardson,TX,USA

2. The Univeristy of Texas at Dallas

3. Semiconductor Packaging Group, Texas Instruments Inc.,Dallas,TX,USA

4. Texas Instruments Inc.,Kilby labs,Dallas,TX,USA

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195299.pdf?arnumber=10195299

Reference9 articles.

1. Slot Bow-Tie Antenna Integration in Flip-Chip and Embedded Die Enhanced QFN Package for WR8 and WR5 Frequency Bands

2. Low-Cost Packaging of 300 GHz Integrated Circuits With an On-Chip Patch Antenna

3. Methods to Characterize Radiation Patterns of WR5 Band Integrated Antennas in a Flip-Chip Enhanced QFN Package

4. An Overview of the Development of Antenna-in-Package Technology for Highly Integrated Wireless Devices

5. InFO_AiP Technology for High Performance and Compact 5G Millimeter Wave System Integration

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