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Low-Cost Packaging of 300 GHz Integrated Circuits With an On-Chip Patch Antenna

  • Published:2019-11 Issue:11 Volume:18 Page:2444-2448
  • ISSN:1536-1225
  • Container-title:IEEE Antennas and Wireless Propagation Letters
  • language:
  • Short-container-title:Antennas Wirel. Propag. Lett.

Author:

Bakshi Harshpreet S.ORCID,Byreddy Pranith R.ORCID,Kenneth K.O.ORCID,Blanchard A.,Lee MarkORCID,Tuncer Enis,Choi WooyeolORCID

Funder

Defense Advanced Research Projects Agency

University of California

Texas Instruments Foundational Technology Research Program on millimeter-wave and high-frequency microsystems

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Cited by 16 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Flip Chip-Enhanced QFN Package Millimeter-Wave Slot Bowtie Antenna Performance using Two Feeding Methodologies;2024 IEEE/MTT-S International Microwave Symposium - IMS 2024;2024-06-16

2. Design and Simulation Study of 300-GHz Molded Patch Antenna in Packaging Substrate;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. 450 GHz On-Chip Dual-Patch Antennas With Expanded Bandwidth and Filtering Response;IEEE Transactions on Antennas and Propagation;2024-04

4. Silicon Technology Innovation Opportunities for Applications at 0.1 to 1 THz Beyond that for Transistors;ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference (ESSDERC);2023-09-11

5. An integrated 60 GHz differential-fed patch array antenna in low-cost QFN package;Microelectronics Journal;2023-07
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