High Frequency Characterization of Ajinomoto Build-Up (ABF) Laminates for Millimeter Wave Applications
Author:
Affiliation:
1. The University of Texas at Dallas,Richardson,Texas,USA
2. Texas Instruments Inc.,Dallas,Texas,USA
Funder
Semiconductor Research Corporation
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10660667/10660643/10660762.pdf?arnumber=10660762
Reference6 articles.
1. The Brooklyn 5G Summit,2018
2. A Novel Approach to Measure and Characterize Radiation Patterns of Antenna-in-Package
3. Characterization of ABF/Glass/ABF Substrates for mmWave Applications
4. Broadband Dielectric Properties of Integrated Circuit Packaging Materials Across the 6G Spectrum
5. Investigation of copper plated-through-holes in glass fiber reinforced epoxy substrates using AC impedance spectroscopy
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