Slot Bow-Tie Antenna Integration in Flip-Chip and Embedded Die Enhanced QFN Package for WR8 and WR5 Frequency Bands
Author:
Affiliation:
1. The University of Texas at Dallas,Eric Johnson School,Department of Elctrical and Computer Engineering,Richardson,TX,USA,75080
2. Amkor Technologies Inc.,Adjunct Faculty,Dallas,UT
3. Texas Instruments Inc.,Dallas,TX,USA,75243
Funder
Semiconductor Research Corporation
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816668.pdf?arnumber=9816668
Reference8 articles.
1. InFO_AiP Technology for High Performance and Compact 5G Millimeter Wave System Integration
2. 122 GHz antenna-integration in a plastic package based on a flip chip interconnect
3. Antennas in Glass Interposer For sub-THz Applications
4. 300-GHz LTCC horn antennas based on antenna-in-package technology;tajima;2013 European Microwave Conference,2013
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. A Novel Approach to Measure and Characterize Radiation Patterns of Antenna-in-Package;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
2. Methods to Characterize Radiation Patterns of WR5 Band Integrated Antennas in a Flip-Chip Enhanced QFN Package;2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS);2022-10-09
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