Next Generation Infrared (IR) Laser Debonding / Silicon Handle Technology for Precision Chiplet Technology Applications-Reference-Cited by-同舟云学术

Next Generation Infrared (IR) Laser Debonding / Silicon Handle Technology for Precision Chiplet Technology Applications

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
language:
Short-container-title:

Author:

Chen Qianwen¹,Belyansky Michael¹,Sulehria Yasir¹,Horibe Akihiro¹,Qin Liqiao¹,Pujari Ruturaj¹,Perfecto Eric¹,Lie Fee Li¹,Butt Shahid¹,Polomoff Nick¹,Miyazawa Risa¹,Kohara Sayuri¹,Farooq Mukta¹,Hisada Takashi¹,Oakley Jennifer¹,Skordas Spyridon¹,Fan Susan¹,Sakuma Katsuyuki¹,Knickerbocker John¹,Mcherron Dale¹,Tamura Takeshi²,Ishii Takayuki²,Jaipan Panupong²,Nishimura Satoshi²,Son Ilseok²,Maeda Yohei²,Koga Takashi²,Klein Joseph²,Tashiro Kei²,Arkalgud Sitaram²,Kondo Yoshihiro²

Affiliation:

1. IBM Research,Albany,NY,USA,12203

2. Tokyo Electron,Tokyo,Japan,107-6325

Funder

IBM

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195447.pdf?arnumber=10195447

Reference8 articles.

1. Voids-free Die-level Cu/ILD Hybrid bonding;sakuma;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),0

2. Ultrathin glass wafer lamination and laser debonding to enable glass interposer fabrication

3. Advanced wafer bonding and laser debonding

4. Factors in the selection of temporary wafer handlers for 3D/2.5D integration

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. IR Laser Debond From Silicon Carrier Wafers With Inorganic Thin Film Release Layers for High-Density 2.5D and 3D Integration;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. IR Laser Release for 3D Stacked Devices: Effect of the Release Stack Structure on the Debonding Mechanism;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. システムインテグレーション実装技術の現状と展望（3Dチップレット集積のトレンドとこれから）;Journal of The Japan Institute of Electronics Packaging;2024-01-01