Factors in the selection of temporary wafer handlers for 3D/2.5D integration-Reference-Cited by-同舟云学术

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Factors in the selection of temporary wafer handlers for 3D/2.5D integration

Published:2014-05 Issue: Volume: Page:
ISSN:
Container-title:2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
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Author:

Dang Bing,Webb Bucknell,Tsang Cornelia,Andry Paul,Knickerbocker John

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/6884273/6897249/06897343.pdf?arnumber=6897343

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Next Generation Infrared (IR) Laser Debonding / Silicon Handle Technology for Precision Chiplet Technology Applications;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

2. Fundamentals and Failures in Die Preparation for 3D Packaging;3D Microelectronic Packaging;2020-11-24

3. Low-temperature multichip-to-wafer 3D integration based on via-last TSV with OER-TEOS-CVD and microbump bonding without solder extrusion;2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020-06

4. Temporary SiC-SiC Wafer Bonding Compatible with High Temperature Annealing;2019 IEEE 69th Electronic Components and Technology Conference (ECTC);2019-05

5. De-bondable SiC SiC wafer bonding via an intermediate Ni nano-film;Applied Surface Science;2019-01

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