Ultrathin glass wafer lamination and laser debonding to enable glass interposer fabrication-Reference-Cited by-同舟云学术

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Ultrathin glass wafer lamination and laser debonding to enable glass interposer fabrication

Published:2015-05 Issue: Volume: Page:
ISSN:
Container-title:2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
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Author:

Shen Wen-Wei,Chang Hsiang-Hung,Wang Jen-Chun,Ko Cheng-Ta,Tsai Leon,Wang Bor Kai,Shorey Aric,Lee Alvin,Su Jay,Bai Dongshun,Huang Baron,Lo Wei-Chung,Chen Kuan-Neng

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7133058/7159553/07159818.pdf?arnumber=7159818

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. IR Laser Debond From Silicon Carrier Wafers With Inorganic Thin Film Release Layers for High-Density 2.5D and 3D Integration;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Next Generation Infrared (IR) Laser Debonding / Silicon Handle Technology for Precision Chiplet Technology Applications;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

3. RF Glass Technology Is Going Mainstream: Review and Future Applications;IEEE Journal of Microwaves;2023-04

4. Room Temperature Temporary Bonding of Glass Substrates Based on SAB Method Using Si Intermediate Layer;IEEE Transactions on Components, Packaging and Manufacturing Technology;2017-10

5. Introduction to Flexible Glass Substrates;Flexible Glass;2017-08-18

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