The Full-IMCs Interconnects through Transient Liquid Phase Bonding of Ga/Cu System for Advanced Electronic Packaging
Author:
Affiliation:
1. Wolfson School of Mechanical and Manufacturing Engineering Loughborough University,Leicestershire,UK
2. Loughborough University,Loughborough Materials Characterisation Center,Leicestershire,UK
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195666.pdf?arnumber=10195666
Reference21 articles.
1. Fast and Reliable Ag–Sn Transient Liquid Phase Bonding by Combining Rapid Heating with Low-Power Ultrasound
2. Materials, processing and reliability of low temperature bonding in 3D chip stacking
3. Transient liquid phase bonding with Ga-based alloys for electronics interconnections
4. A Review on Recent Advances in Transient Liquid Phase (TLP) Bonding for Thermoelectric Power Module
5. Interfacial Reactions between Ga and Cu-10Ni Substrate at Low Temperature
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1. Interfacial Intermetallic Compounds Growth Kinetics and Mechanical Characteristics of Ga-Cu Interconnects Prepared Via Transient Liquid Phase Bonding;2023
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