Interfacial intermetallic compounds growth kinetics and mechanical characteristics of Ga-Cu interconnects prepared via transient liquid phase bonding-Reference-Cited by-同舟云学术

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Interfacial intermetallic compounds growth kinetics and mechanical characteristics of Ga-Cu interconnects prepared via transient liquid phase bonding

Published:2024-03 Issue: Volume:38 Page:108401
ISSN:2352-4928
Container-title:Materials Today Communications
language:en
Short-container-title:Materials Today Communications

Author:

Chen Yi,Jiang Han,Zhou Zhaoxia,Liu Changqing

Funder

EPSRC

Publisher

Elsevier BV

Reference35 articles.

1. Novel and fast transient liquid phase bonding using etched Cu foam/Sn–3.0 Ag–0.5 Cu composite solder preform;Heo;Mater. Today Commun.,2023

2. Cu3Sn joint based on transient liquid phase bonding of Cu@ Cu6Sn5 core–shell particles;Wang;Sci. Rep.,2023

3. Morphology evolution and grain orientations of intermetallic compounds during the formation of full Cu3Sn joint;Yang;Intermetallics,2022

4. Interfacial structures and mechanical properties of Cu/Sn/Cu containing SiC nanowires under transient liquid phase bonding;Li;Intermetallics,2022

5. Effect of kaolin geopolymer ceramic addition on the properties of Sn-3.0 Ag-0.5 Cu solder joint;Zaimi;Mater. Today Commun.,2020

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