Creative Design and Structure Applied to Chiplets Packaging-Reference-Cited by-同舟云学术

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Creative Design and Structure Applied to Chiplets Packaging

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
language:
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Author:

Wang Chen-Chao¹,Huang Chih-Yi¹,Kuo Hung-Chun¹,Jhong Ming-Fong¹,Chu Fu-Chen¹,Lai Chung-Hung²,Huang Hung-Hsien²,Hung Chih-Pin²

Affiliation:

1. ASE Group,Product Design Division, CRD,Kaohsiung,Taiwan

2. CRD, ASE Group,Product Characterization Division,Kaohsiung,Taiwan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195660.pdf?arnumber=10195660

Reference5 articles.

1. Scalable Chiplet package using Fan-Out Embedded Bridge

2. Ultra High Density Package Design and Electrical Analysis in High Performance Computing Application

3. Electrical Performances of Fan-Out Embedded Bridge

4. Heterogeneous SoC Integration with EMIB

5. Embedded Multi-die Interconnect Bridge (EMIB) -- A High Density, High Bandwidth Packaging Interconnect

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. High Speed D2D Interface Applied on Advanced Package;2024 International Conference on Electronics Packaging (ICEP);2024-04-17

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