Author:
Lin Joe,Chung C. Key,Lin C. F.,Liao Ally,Lu Ying Ju,Shuang Chen Jia,Ng Daniel
Cited by
32 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. High Speed D2D Interface Applied on Advanced Package;2024 International Conference on Electronics Packaging (ICEP);2024-04-17
2. Security Advantages and Challenges of 3D Heterogeneous Integration;Computer;2024-03
3. High Thermal Solution for 3D Integration Package;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05
4. Heterogeneous Die-to-Die Interfaces: Enabling More Flexible Chiplet Interconnection Systems;56th Annual IEEE/ACM International Symposium on Microarchitecture;2023-10-28
5. 3D FO package technology using bridge die for high number of chiplets integration;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08