Author:
Hsieh Tsun-Lung,Kuo Hung-Chun,Jhong Ming-Fong,Huang Chih-Yi,Wang Chen-Chao
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. High Speed D2D Interface Applied on Advanced Package;2024 International Conference on Electronics Packaging (ICEP);2024-04-17
2. Creative Design and Structure Applied to Chiplets Packaging;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05