Evaluation on bonding reliability of SAC305/Sn-57.5Bi-0.4Ag BGA solder joints with drop impact test
Author:
Affiliation:
1. Sungkyunkwan University,Department of Semiconductor and Display Engineering,Suwon,South Korea
2. Sungkyunkwan University,School of Advanced Materials Science & Engineering,Suwon,South Korea
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816586.pdf?arnumber=9816586
Reference9 articles.
1. Board-level drop reliability and fracture behavior of low-temperature soldering Sn–Ag–Cu/Sn–Bi–X hybrid BGA solder joints for consumer electronics
2. A comparative study of thermal fatigue life of Eutectic Sn-Bi, Hybrid Sn-Bi/SAC and SAC solder alloy BGAs
3. Reliability of homogeneous Sn-Bi and hybrid Sn-Bi/SAC BGAs;cai;2020 IEEE 70th Electronic Components and Technology Conference (ECTC),2020
4. Size effects on the interfacial reaction and microstructural evolution of Sn-ball/Sn3.0Ag0.5Cu-paste/Cu joints in board-level hybrid BGA interconnection at critical reflowing temperature
5. Microstructural evolution and joint strength of Sn-58Bi/Cu joints through minor Zn alloying substrate during isothermal aging
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Board Level Drop Reliability of Hybrid Solder Joints with Controlled Bismuth Mixing Ratio for Carbon Neutrality;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. Al2O3 nanofibers reinforced Sn58Bi/SAC 305 hybrid joints for low temperature ball grid array bonding;Materials Today Communications;2024-03
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