Microstructural evolution and joint strength of Sn-58Bi/Cu joints through minor Zn alloying substrate during isothermal aging-Reference-Cited by-同舟云学术

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Microstructural evolution and joint strength of Sn-58Bi/Cu joints through minor Zn alloying substrate during isothermal aging

Published:2016-12 Issue: Volume:688 Page:639-648
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Wang Fengjiang,Zhou Lili,Wang Xiaojing,He Peng

Funder

National Natural Science Foundation of China

Jiangsu Planning Project of Science and Technology

State Key Lab of Advanced Welding & Joining, Harbin Institute of Technology

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference42 articles.

1. Feasibility Study of 57Bi-42Sn-1Ag Solder;Schroeder,2001

2. Thermal Resistance Analysis of Sn-Bi Solder Paste Used as Thermal Interface Material for Power Electronics Applications

3. Comparison of Sn2.8Ag20In and Sn10Bi10In solders for intermediate-step soldering

4. Interfacial reactions between lead-free solders and common base materials

Cited by 55 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Microstructures of ternary Sn-Bi-xZn alloys on mechanical and electrochemical properties analysis for connection packaging;Journal of Alloys and Compounds;2024-10

2. Effect of (111) oriented nanotwinned Cu substrate on the electromigration of Sn58Bi solder joint at high current density;Journal of Materials Science: Materials in Electronics;2024-07

3. Microstructure and mechanical behavior of Sn15Bi-xAg\Cu solder joints during isothermal aging;Soldering & Surface Mount Technology;2024-06-04

4. Research Advances and Prospect of Low- Temperature Sn- xBi- yM Alloy Solders for Microelectronic Packaging;RARE METAL MAT ENG;2024

5. Wetting kinetics, spreading phenomena and interfacial reaction of Sn-15Bi-xZn solders on Cu substrate at different temperatures;Soldering & Surface Mount Technology;2023-06-05

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