Author:
Cai Chongyang,Xu Jiefeng,Wang Huayan,Park Seungbae
Cited by
9 articles.
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1. Influence of Stiffener Design on Co-Packaged Optics (CPO) 2.5D Heterogeneous Packages;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. Residual stress measurement of build-up layer in silicon wafers;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
3. Optimal thermo-mechanical reliability design of 2.5D lidless package;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31
4. Characterization of Constitutive Equation of Sn-Bi by Studying Creep Behavior of Flip Chip Solder Joints;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31
5. Revealing the ductile-to-brittle transition mechanism in polycrystalline body-centered tetragonal tin (Sn) for cryogenic electronics;Journal of Alloys and Compounds;2022-05