Optimal thermo-mechanical reliability design of 2.5D lidless package
Author:
Affiliation:
1. The State University of New York at Binghamton,Department of Mechanical Engineering,Binghamton,NY,USA,13902
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9899435/9899496/09899678.pdf?arnumber=9899678
Reference19 articles.
1. Comprehensive Study on 2.5D Package Design for Board-Level Reliability in Thermal Cycling and Power Cycling
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5. Identification of polymer materials in electronic packages including counterfeit prevention
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