Author:
Yang Junbo,Xu Jiefeng,Park Seungbae
Cited by
7 articles.
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2. Effect of Silane Coupling Agents on the Underfill Adhesion undergoing Heat Aging Test;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10
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4. Package Design Through Reliable Predictive Modeling and Its Validation;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
5. An intelligent system for reflow oven temperature settings based on hybrid physics-machine learning model;Soldering & Surface Mount Technology;2022-02-01