Low-Temperature Wafer-to-Wafer Hybrid Bonding by Nanocrystalline Copper
Author:
Affiliation:
1. ITRI,Dept. of Electronics and Optoelectronics System Research Laboratories,Hsinchu,Taiwan
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816596.pdf?arnumber=9816596
Reference16 articles.
1. Fine-Pitch (≤10 µm) Direct Cu-Cu Interconnects Using In-Situ Formic Acid Vapor Treatment
2. High Electromigration Lifetimes of Nanotwinned Cu Redistribution Lines
3. Ultra High Density SoIC with Sub-micron Bond Pitch
4. In-Situ Grown Graphene Enabled Copper Interconnects With Improved Electromigration Reliability
5. Superplastic Extensibility of Nanocrystalline Copper at Room Temperature
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