Low-Temperature Nanocrystalline Cu/polymer Hybrid Bonding with Tailored CMP Process
Author:
Affiliation:
1. Industrial Technology Research Institute (ITRI),Electronics and Optoelectronics System Research Laboratories,Hsinchu,Taiwan
2. Brewer Science Taiwan/Brewer Science, Inc.
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10564841/10564831/10565115.pdf?arnumber=10565115
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