Advanced RDL Interposer PKG Technology for Heterogeneous Integration-Reference-Cited by-同舟云学术

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Advanced RDL Interposer PKG Technology for Heterogeneous Integration

Published:2020-10-13 Issue: Volume: Page:
ISSN:
Container-title:2020 International Wafer Level Packaging Conference (IWLPC)
language:
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Author:

Jang Jae-gwon,Suk Kyoung-lim,Lee Seok-hyun,Park Jin-woo,Jeon Gwang-jae,Park Jung-ho,Jin Jeong-gi,Lee Su-chang,Kim Gyoung-bum,Choi Joo-yeon,Kim Dae-woo,Oh Dan,Choi Won-kyoung

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9375828/9375850/09375895.pdf?arnumber=9375895

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. 2-step CMP Strategy for Dishing Control of TGV Interposers;Journal of the Korean Society for Precision Engineering;2024-06-01

2. Low-Temperature Nanocrystalline Cu/polymer Hybrid Bonding with Tailored CMP Process;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. A Novel Low-Warpage Hyper RDL (HRDL) Interposer Enabled by Low Temperature Hybrid Bonding for Advanced Packaging Applications;IEEE Electron Device Letters;2024-03

4. The HRDL Interposer Technology Using Metal/Polymer Hybrid Bonding and Its Characteristics;IEEE Transactions on Materials for Electron Devices;2024

5. Multi-Stripline Redistribution Layer Interposer Channel Design for High Bandwidth Memory Module Considering Via Interconnect;2023 20th International SoC Design Conference (ISOCC);2023-10-25

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