Low Temperature (250°C) and Fine Pitch (≤4 μ m) New Nanocrystalline Cu/SiO<sub>2</sub> Chip-on-Wafer Hybrid Bonding for 3D Chip Integration-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Low Temperature (250°C) and Fine Pitch (≤4 μ m) New Nanocrystalline Cu/SiO₂ Chip-on-Wafer Hybrid Bonding for 3D Chip Integration

Published:2024-04-22 Issue: Volume: Page:1-2
ISSN:
Container-title:2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA)
language:
Short-container-title:

Author:

Lin Ang-Ying¹,Lin Yu-Min¹,Lu Chun-Lin²,Liao Hsin-Yi²,Yu Chen-Chun¹,Lee Ou-Hsiang¹,Chiu Tsung-Chieh¹,Chiu Wei-Lan¹,Chang Hsiang-Hung¹,Chang Shou-Zen²

Affiliation:

1. Industrial Technology Research Institute,Electronic and Optoelectronic System Research Laboratories,Hsinchu,Taiwan

2. R&D, Powerchip Semiconductor Manufacturing Corporation,Hsinchu,Taiwan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10546337/10546338/10546418.pdf?arnumber=10546418

Reference5 articles.

1. Advanced Packaging-Future Challenges;Suresh

2. Room temperature Cu–Cu direct bonding using surface activated bonding method

3. Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu

4. The Influence of Cu Microstructure on Thermal Budget in Hybrid Bonding

5. Low-Temperature Wafer-to-Wafer Hybrid Bonding by Nanocrystalline Copper

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP