Effect of Thermal Aging on the Evolution of Anand Parameters for SAC105 Leadfree Alloys Operating at Cold Temperatures down to -55 °C
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Publisher
IEEE
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http://xplorestaging.ieee.org/ielx7/9184804/9190160/09190376.pdf?arnumber=9190376
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Shock and Vibration Simulation for PBGA Board Assemblies with SAC Solder Interconnects using Non-Linear High Strain Rate Properties;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30
2. Modified Multipoint Constraints of Finite Element Model for SJR Prediction Accuracy;2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT);2022-10-19
3. Effect of SAC105 Solder Alloys High Strain Rate Property Evolution on Plastic Work at Low Operating Temperatures;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31
4. Extreme Low-Temperature High Strain-Rate Constitutive Behavior Evolution of Doped and Undoped Leadfree Solders under Sustained High Temperature Exposure;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
5. Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature;Journal of Electronic Packaging;2022-03-11
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