Extreme Low-Temperature High Strain-Rate Constitutive Behavior Evolution of Doped and Undoped Leadfree Solders under Sustained High Temperature Exposure-Reference-Cited by-同舟云学术

Extreme Low-Temperature High Strain-Rate Constitutive Behavior Evolution of Doped and Undoped Leadfree Solders under Sustained High Temperature Exposure

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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Author:

Lall Pradeep¹,Mehta Vishal¹,Yadav Vikas¹,Saha Mrinmoy¹,Suhling Jeff¹,Locker Dave²

Affiliation:

1. Auburn University,NSF-CAVE3 Electronics Research Center,Department of Mechanical Engineering,Auburn,AL,36849

2. US Army Combat Capabilities,Development Command, CCDC-AvMC,Huntsville,AL,35898

Funder

Auburn University

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816739.pdf?arnumber=9816739

Reference35 articles.

1. Plausible extension of Anand's model to metals exhibiting dynamic recrystallization and its experimental validation

2. Anand model and FEM analysis of SnAgCuZn lead-free solder joints in wafer level chip scale packaging devices

3. Separation of electromagnetic and plasma modes in a two-fluid, lossy, compressible plasma

4. A Compilation of Anand Parameters for Selected SnPb and Pb-free Solder Alloys;johnson,2012

5. Investigation of Aging Induced Microstructural Changes in Doped SAC+X Solders

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1. Impact of Bi-Content on the High Strain Rate Properties of SnAgCu Solders Under Sustained High-Temperature Operation;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Evolution of Propensity for High Strain-Rate Damage Accrual in Doped and Undoped SnAgCu Lead-free Solders in Temperature Range of -65°C to +200°C after 1-Year Sustained High Temperatures Exposure;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05