Evolution of Propensity for High Strain-Rate Damage Accrual in Doped and Undoped SnAgCu Lead-free Solders in Temperature Range of -65°C to +200°C after 1-Year Sustained High Temperatures Exposure-Reference-Cited by-同舟云学术

Evolution of Propensity for High Strain-Rate Damage Accrual in Doped and Undoped SnAgCu Lead-free Solders in Temperature Range of -65°C to +200°C after 1-Year Sustained High Temperatures Exposure

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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Author:

Lall Pradeep¹,Mehta Vishal¹,Yadav Vikas¹,Saha Mrinmoy¹,Suhling Jeff¹

Affiliation:

1. Auburn University,NSF-CAVE3 Electronics Research Center,Department of Mechanical Engineering,Auburn,AL,36849

Funder

National Science Foundation

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195288.pdf?arnumber=10195288

Reference22 articles.

1. High Strain Rate Properties of M758 Solder at Extreme Operating Temperatures

2. Low-Temperature High Strain Rate Constitutive Behavior of Doped and Undoped SnAgCu Solder Alloys after Prolonged Storage at High Temperature

3. High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days

4. Effect of Evolution of High Strain Rate Properties on Plastic-Work of SAC305 Alloy with 100°C Aging for Periods up to 240-days

5. Mechanical characterization of Sn–Ag-based lead-free solders

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1. Impact of Bi-Content on the High Strain Rate Properties of SnAgCu Solders Under Sustained High-Temperature Operation;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28