Low-Temperature High Strain Rate Constitutive Behavior of Doped and Undoped SnAgCu Solder Alloys after Prolonged Storage at High Temperature
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Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501594.pdf?arnumber=9501594
Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Impact of Bi-Content on the High Strain Rate Properties of SnAgCu Solders Under Sustained High-Temperature Operation;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. A machine learning and finite element simulation-based void inspection for higher solder joint reliability;Microelectronics Reliability;2024-03
3. Leadfree SnAgCu Solder Materials Characterization at High Strain Rates at Low Test Temperatures and Drop and Shock Simulation Using Input-G Method;Journal of Electronic Packaging;2023-11-10
4. Shock and Vibration Simulation for PBGA Board Assemblies with SAC Solder Interconnects using Non-Linear High Strain Rate Properties;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30
5. Evolution of Propensity for High Strain-Rate Damage Accrual in Doped and Undoped SnAgCu Lead-free Solders in Temperature Range of -65°C to +200°C after 1-Year Sustained High Temperatures Exposure;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
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