Shock and Vibration Simulation for PBGA Board Assemblies with SAC Solder Interconnects using Non-Linear High Strain Rate Properties
Author:
Affiliation:
1. Auburn University,NSF-CAVE3 Electronics Research Center,Department of Mechanical Engineering,Auburn,AL,36849
2. US Army CCDC-AvMC,Huntsville,AL
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10177286/10177494/10177673.pdf?arnumber=10177673
Reference43 articles.
1. Gupte, Failure Envelope Approach to Modeling Shock and Vibration Survivability of Electronic and MEMS Packaging;lall;Proc 55th ECTC,0
2. Material characterization of a novel lead-free solder material — SACQ
3. Models for reliability prediction of fine-pitch BGAs and CSPs in shock and drop-impact
4. The effects of aging temperature on SAC solder joint material behavior and reliability;zhang;2008 58th Electronic Components and Technology Conference,0
5. A Methodology for Fatigue Prediction of Electronic Components Under Random Vibration Load
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