Shock and Vibration Simulation for PBGA Board Assemblies with SAC Solder Interconnects using Non-Linear High Strain Rate Properties

Author:

Lall Pradeep1,Yadav Vikas1,Suhling Jeff1,Locker David2

Affiliation:

1. Auburn University,NSF-CAVE3 Electronics Research Center,Department of Mechanical Engineering,Auburn,AL,36849

2. US Army CCDC-AvMC,Huntsville,AL

Publisher

IEEE

Reference43 articles.

1. Gupte, Failure Envelope Approach to Modeling Shock and Vibration Survivability of Electronic and MEMS Packaging;lall;Proc 55th ECTC,0

2. Material characterization of a novel lead-free solder material — SACQ

3. Models for reliability prediction of fine-pitch BGAs and CSPs in shock and drop-impact

4. The effects of aging temperature on SAC solder joint material behavior and reliability;zhang;2008 58th Electronic Components and Technology Conference,0

5. A Methodology for Fatigue Prediction of Electronic Components Under Random Vibration Load

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