Mechanical characterization of Sn–Ag-based lead-free solders

Author:

Amagai Masazumi,Watanabe Masako,Omiya Masaki,Kishimoto Kikuo,Shibuya Toshikazu

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference25 articles.

1. Lau John H, Pao Yi-Hsin. Solder joint reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT assemblies. McGraw-Hill, 1997. p. 1–405

2. Amagai M. The effect of polymer die attach material on solder joint reliability. In: Proceedings of the ASME Workshop on Mechanical Reliability of Polymeric Materials of IC Devices, Paris, France, November 1998. p. 223–30

3. Amagai M. Chip scale package solder joint reliability. In: Proceedings of the IEEE 36th International Reliability Physics Symposium, Reno, USA, April 1998. p. 260–8

4. Solder joint fatigue life model;Darveaux,1997

5. Chip scale package (CSP) solder joint reliability and modeling;Amagai;Microelectron. Reliab.,1999

Cited by 157 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Stable SnAgCu solder joints reinforced by nickel-coated carbon fiber for electronic packaging;Engineering Fracture Mechanics;2024-08

2. Impact of Bi-Content on the High Strain Rate Properties of SnAgCu Solders Under Sustained High-Temperature Operation;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. Mechanical Characterization and Modeling of iSAC Lead-Free Solder;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

4. Aluminum addition to Sn-3Ag-0.5Cu-1In-xAl alloy effect on corrosion kinetics in HCl acid solution;Microelectronics Reliability;2024-01

5. Low temperature bonding of Cu/Sn58Bi/Cu with 5μm microbump for high temperature applications;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3