Author:
Amagai Masazumi,Watanabe Masako,Omiya Masaki,Kishimoto Kikuo,Shibuya Toshikazu
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference25 articles.
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3. Amagai M. Chip scale package solder joint reliability. In: Proceedings of the IEEE 36th International Reliability Physics Symposium, Reno, USA, April 1998. p. 260–8
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