Modified Multipoint Constraints of Finite Element Model for SJR Prediction Accuracy-Reference-Cited by-同舟云学术

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Modified Multipoint Constraints of Finite Element Model for SJR Prediction Accuracy

Published:2022-10-19 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT)
language:
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Author:

Ting-Wen Chen¹,Bin Bakhtiar Muhammad Zulfadhli²,Shin-Yueh Yang¹,Yeow Chon Ong³,Glancey Christopher⁴,Takiar Hem⁴

Affiliation:

1. Micron Technology, Inc.,Package Development and Engineering,Taichung,Taiwan

2. Micron Technology, Inc.,Package Development and Engineering,Penang,Malaysia

3. Micron Technology, Inc.,Package Development and Engineering,Singapore,Singapore

4. Micron Technology, Inc.,Package Development and Engineering,Boise,U.S.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9969384/9969385/09969516.pdf?arnumber=9969516

Reference7 articles.

1. Updated Life Prediction Models for Solder Joints with Removal of Modeling Assumptions and Effect of Constitutive Equations

2. Finite element based solder joint fatigue life predictions for a same die size-stacked-chip scale-ball grid array package

3. Effect of Thermal Aging on the Evolution of Anand Parameters for SAC105 Leadfree Alloys Operating at Cold Temperatures down to -55 °C

4. Improved finite element modeling strategies with multipoint constraints for BGA packages subjected to thermal cycling

5. Material characterization of a novel lead-free solder material — SACQ

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1. Efficient, Self-Supervised Human Pose Estimation with Inductive Prior Tuning;2023 IEEE/CVF International Conference on Computer Vision Workshops (ICCVW);2023-10-02

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