Updated Life Prediction Models for Solder Joints with Removal of Modeling Assumptions and Effect of Constitutive Equations-Reference-Cited by-同舟云学术

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Updated Life Prediction Models for Solder Joints with Removal of Modeling Assumptions and Effect of Constitutive Equations

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Container-title:7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems
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Author:

Syed A.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/10938/34453/01644010.pdf?arnumber=1644010

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Predictive Reliability Assessment Workflow for System-Level Reliability of Solder Interconnections;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07

2. Life-Prediction of SAC305/Bi-based Hybrid Solder Joint Considering Bi-Diffused Layers with Gradual Bi Concentrations;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

3. Modified Multipoint Constraints of Finite Element Model for SJR Prediction Accuracy;2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT);2022-10-19

4. Thermal fatigue life of ball grid array (BGA) solder joints made from different alloy compositions;Engineering Failure Analysis;2021-07

5. Investigation and analysis of thermo-mechanical degradation of fingers in a photovoltaic module under thermal cyclic stress conditions;Solar Energy;2018-11

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