Life-Prediction of SAC305/Bi-based Hybrid Solder Joint Considering Bi-Diffused Layers with Gradual Bi Concentrations
Author:
Affiliation:
1. University of Maryland,Mechanical Engineering Department,College Park,MD,USA,20742
2. Hanyang University,Departement of Mechanical Convergence Engineering,Seoul,South Korea,04763
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195828.pdf?arnumber=10195828
Reference14 articles.
1. A comparative study of thermal fatigue life of Eutectic Sn-Bi, Hybrid Sn-Bi/SAC and SAC solder alloy BGAs
2. Determination of Anand constants for SAC solders using stress-strain or creep data
3. Updated Life Prediction Models for Solder Joints with Removal of Modeling Assumptions and Effect of Constitutive Equations
4. Low Operating-Temperature High Strain Rate Constitutive Behavior of SnAgCu Solder Alloys after Prolonged Storage at High Temperature
5. Mechanical Behavior and Reliability of SAC+Bi Lead Free Solders with Various Levels of Bismuth
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